Ibhodi yokuNyekiswa kwe-GE DS200CTBAG1ACC
Inkcazo
Ukwenziwa | GE |
Umzekelo | Idatha ye-DS200CTBAG1ACC |
Ukuodola ulwazi | Idatha ye-DS200CTBAG1ACC |
Ikhathalogu | Speedtronic Mark V |
Inkcazo | Ibhodi yokuNyekiswa kwe-GE DS200CTBAG1ACC |
Imvelaphi | eMelika (US) |
Ikhowudi ye-HS | 85389091 |
Ubungakanani | 16cm*16cm*12cm |
Ubunzima | 0.8kg |
Iinkcukacha
Ibhodi yesekethe eprintiweyo ye-DS200CTBAG1ACC isebenza njengebhodi ye-GE Mark V ye-Common Data Processor Termination board. Ngelixa le nxalenye ngoku ibekwe kwimeko yelifa nguGeneral Electric kwaye ayisaxhaswa ngumenzi wokuqala, inkampani yethu isebenza nzima ukugcina isitokhwe esisesandleni ukuze sikwazi ukubonelela abathengi bethu ngokutshintshwa njengoko kufuneka.
I-DS200CTBAG1ACC yiPCB ende nemxinwa esetyenziswa njengebhodi yokuphelisa kwiprosesa yedatha eqhelekileyo kaMark V. Ikhadi lihlala lifakwa
I-DS200CTBAG1ACC yamkela i-4-20 mA igalelo kunye neempawu zemveliso kunye ne-shaft voltage kunye neempawu zangoku zeshaft. Ibhodi ine-bypass relay kumphezulu wayo. Oku kuvumela ukuqhubeka konxibelelwano lwe-COREBUS nangona amandla elahlekile kwibhodi ye-CTBA.
I-DS200CTBAG1ACC ibandakanya iintambo ezimbini ze-terminal, izihlanganisi ze-pin ezithe nkqo, i-relay, i-resistor network arrays, izihlanganisi zeplagi, kunye nokutshintsha kwe-jumper. Ibhodi iphawulwe ngelogo ye-GE kwaye ikwaphethe inombolo yebhodi yokuchonga. Ibhodi iye yagrunjwa kwikona nganye ukuvumela ukhetho lokunyuka; eminye yale mingxunya yokugrumba ifakwe kwi-conductive material.
I-DS200CTBAG1ACC yibhodi ye-terminal ebekwe kwi-C core. Iimpawu eziphambili zetheminali zilandela ngolu hlobo: Ma. igalelo kunye noMa. imveliso, ikhonkco lonxibelelwano lwe-IONET kunye nekhonkco lonxibelelwano ukuyaiprosesa (ArcNet). . I-DS200CTBAG1ACC yibhodi ye-terminal ebekwe kwi-C core. Iimpawu eziphambili zetheminali zilandela ngolu hlobo: Ma. igalelo kunye noMa. imveliso, ikhonkco lonxibelelwano lwe-IONET kunye nekhonkco lonxibelelwano ukuyaiprosesa (ArcNet).